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STENCIL PER REBALLING BGA CPU SAMSUNG GALAXY A14 / A25 / A54 EXYNOS 1330 / E8835P / MT6789V 0.12 MM SAM18 V3.0 AMAOE
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STENCIL PER REBALLING BGA CPU SAMSUNG GALAXY A14 / A25 / A54 EXYNOS 1330 / E8835P / MT6789V 0.12 MM SAM18 V3.0 AMAOE
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| Item code: | 786912227 |
|---|---|
| Availability: | Available |
| Weight: | 0,100 Kg |
| Quantity: |
Description
Stencil per reballing BGA CPU Samsung A14 - A25 - A54 EXYNOS 1330 - E8835P - MT6789V 0.12 MM AMAOE
Stencil professionale.
Acquista prima delle 14.00 e spediremo il giorno stesso.
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