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STENCIL PER REBALLING FULL IC - CPU SAMSUNG S7 MSM8996 QL25 MEGA-IDEA
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STENCIL PER REBALLING FULL IC - CPU SAMSUNG S7 MSM8996 QL25 MEGA-IDEA
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| Item code: | 136098928 |
|---|---|
| Availability: | Available |
| Weight: | 0,100 Kg |
| Quantity: |
Description
Stencil per reballing full IC per Samsung S7 MSM8996
Marca: Mega-Idea
Modello: QL25
Stencil professionale.
Acquista prima delle 14.00 e spediremo il giorno stesso.
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