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STENCIL PER REBALLING BGA CPU SAMSUNG GALAXY S23 / S23 ULTRA / S24 / S24 ULTRA 0.12 MM SAM19 V2.0 AMAOE
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STENCIL PER REBALLING BGA CPU SAMSUNG GALAXY S23 / S23 ULTRA / S24 / S24 ULTRA 0.12 MM SAM19 V2.0 AMAOE
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| Item code: | 786912228 |
|---|---|
| Availability: | Available |
| Weight: | 0,100 Kg |
| Quantity: |
Description
Stencil per reballing BGA CPU Samsung S23 - S23 Ultra - S24 - S24 Ultra 0.12 MM AMAOE
-SNAPDRAGON 8GEN2 SM8550 / 8GEN3 SM8650
-EXYNOS 2400
-E9945
Stencil professionale.
Acquista prima delle 14.00 e spediremo il giorno stesso.
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