This website uses cookies to give you the best experience. By using this website you consent to the use of the cookies.

CustomizeAccept
CLOSE
  • Close
  • EN
Search by brand

2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 8 / 8 PLUS / X QS04 QIANLI

2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 8 / 8 PLUS / X QS04 QIANLI2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 8 / 8 PLUS / X QS04 QIANLI2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 8 / 8 PLUS / X QS04 QIANLI2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 8 / 8 PLUS / X QS04 QIANLI2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 8 / 8 PLUS / X QS04 QIANLI2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 8 / 8 PLUS / X QS04 QIANLI2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 8 / 8 PLUS / X QS04 QIANLI2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 8 / 8 PLUS / X QS04 QIANLI
Use Mouse Wheel to Zoom In/Out

2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 8 / 8 PLUS / X QS04 QIANLI

Users feedback

Item code: X0294
Availability: Available
Weight: 0,100 Kg
Quantity:

Description

Stencil 2D in per Reballing iPhone 8 - iPhone 8 Plus - iPhone X QianLi

Stencil completo per reballing: IC + NAND + Baseband + Ram + CPU
Professionale resistente alle alte temperature.

Acquista prima delle 14.00 e spediremo il giorno stesso.
Shopping cart

Shopping cart is empty

ISCRIVITI ALLA NEWSLETTER




Pagamenti sicuri con paypal e carte di credito
Ready Pro ecommerce