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2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 11 / 11 PRO / 11 PRO MAX QS06 QIANLI

2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 11 / 11 PRO / 11 PRO MAX QS06 QIANLI2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 11 / 11 PRO / 11 PRO MAX QS06 QIANLI2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 11 / 11 PRO / 11 PRO MAX QS06 QIANLI2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 11 / 11 PRO / 11 PRO MAX QS06 QIANLI2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 11 / 11 PRO / 11 PRO MAX QS06 QIANLI2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 11 / 11 PRO / 11 PRO MAX QS06 QIANLI2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 11 / 11 PRO / 11 PRO MAX QS06 QIANLI2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 11 / 11 PRO / 11 PRO MAX QS06 QIANLI
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2D STENCIL FOR REBALLING FULL IC - NAND - BOARDBAND - CPU - RAM IPHONE 11 / 11 PRO / 11 PRO MAX QS06 QIANLI

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Item code: 10195
Availability: Not available
Weight: 0,100 Kg
Quantity:

Description

Stencil 2D in per Reballing iPhone serie 11 QianLi

Stencil completo per reballing: IC + NAND + Baseband + Ram + CPU
Professionale resistente alle alte temperature.

Acquista prima delle 14.00 e spediremo il giorno stesso.
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