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COPPER HEAT SINK FOR CELL PHONE REPAIR 1.0MM
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COPPER HEAT SINK FOR CELL PHONE REPAIR 1.0MM
Users feedback
| Item code: | H471 |
|---|---|
| Availability: | Not available |
| Weight: | 0,100 Kg |
| Quantity: |
Description
Dissipatore Di Calore Per Riparazione Smartphone.
-Materiale: rame
-Spessore: 0.1mm
-Superficie e bordi lisci.
-Acquista prima delle 14.00 e spediremo il giorno stesso.
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