Smartphone Repair Heat Sink
"The RL-093 Chip Heat Sink Copper Sheet by RELIFE is designed to provide efficient heat dissipation for electronic components such as CPUs and chipsets. Made from high-quality copper, these sheets offer exceptional corrosion resistance and rapid thermal conduction, ensuring superior heat dissipation. With multiple specifications available, these sheets are perfect for a wide range of technical and repair applications.
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"Key Features:
High-performance heat dissipation: Superior thermal conduction to prevent overheating.
High-quality material: Pure copper, corrosion-resistant for long-lasting reliability.
Multiple specifications: Available in thicknesses of 0.1 mm, 0.3 mm, and 0.5 mm for various technical needs.
Universal compatibility: Suitable for motherboards, BGA chips, CPUs, and other electronic components.
Compact dimensions: Perfect for precision applications.
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"Technical Specifications:
Brand: RELIFE
Model: RL-093 A
Material: Pure copper
Product dimensions: 12.45 mm x 14 mm
Thickness:
A: 0.5 mm
Weight:
A: 43,5 g
"Quantity: 50 pieces per package