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STENCIL 2D PER REBALLING FULL IC - CPU IPHONE 6 / 6 PLUS BZ27 MEGA-IDEA

STENCIL 2D PER REBALLING FULL IC - CPU IPHONE 6 / 6 PLUS BZ27 MEGA-IDEA
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STENCIL 2D PER REBALLING FULL IC - CPU IPHONE 6 / 6 PLUS BZ27 MEGA-IDEA

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Item code: 10207
Availability: Available
Weight: 0,100 Kg
Quantity:

Description

Stencil 2D in per Reballing iPhone 6 e iPhone 6 Plus Mega-Idea.

Stencil completo per reballing: IC + CPU
Professionale resistente alle alte temperature.

Acquista prima delle 14.00 e spediremo il giorno stesso.
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